Product performance | Boraychem | American D company | Japan U company |
Solid content, Wt% |
15-20 |
15-18 |
15-18 |
Solvent |
NMP |
NMP |
NMP |
Viscosity., cP |
2000-6000 |
2000-6000 |
2000-6000 |
Td (1wt%) |
550 |
550 |
550 |
CTE(100-250oC) |
3-8 |
3-10 |
3-8 |
Breaking strength, MPa |
400 |
400 |
350 |
Modulus. GPa |
6 |
6 |
5.8 |
Elongation at break, % |
30 |
23 |
28 |
Product performance | Boraychem | American D company |
thickness, μm |
10 |
10 |
Tg, oC |
> 450 |
450 |
CTE, ppm/K |
8 |
14 |
Td (1wt%) |
476 |
539 |
|
|
|
Breaking strength, MPa |
283 |
171 |
modulus,GPa |
6.9 |
5.2 |
Elongation at break, % |
25 |
9 |
Light transmittance(380-780 nm), % |
88 |
85 |
Yellow index, YI |
2.6 |
4.9 |
Advantages: Low coefficient of thermal expansion, excellent strength, excellent toughness, higher solid content
For the general market, including covering film, lithium battery coating, labels, LED lamp strips, etc
Product performance | |
Thickness, μm |
25 |
Tensile-strength, MPa |
> 200 |
Elongation, % |
> 60 |
Young's modulus, GPa |
> 3.1 |
Dielectric constant |
3.3±0.2 |
Volume resistivity, Ω. cm |
> 10 12 |
Surface resistivity, Ω |
> 10 14 |
Dielectric strength, V/μm |
> 265 |
Percentage of contraction, % |
< 0.2 |
hydroscopicity, % |
< 2 |
Used for covering film and partial copper-clad plate
Product performance | |
Thickness, μm |
12.5 |
Tensile-strength, MPa |
> 210 |
Elongation, % |
> 50 |
Young's modulus, GPa |
> 3.0 |
Dielectric constant |
3.5 |
Volume resistivity, Ω. cm |
> 10 12 |
Surface resistivity, Ω |
> 10 14 |
Dielectric strength, V/μm |
> 200 |
Percentage of contraction, % |
< 0.2 |
Hydroscopicity, % |
< 2 |
BOPI films for FCCL
BOPI films for high thermal conductivity artificial graphite sheets