PI Advanced Materials (PIAM)'s polyimide (PI) materials have excellent heat resistance and are suitable for use in extreme temperature environments. The following are the main features of its heat resistance:
Heat resistance characteristics
High temperature stability: Polyimide materials are able to operate at temperatures up to 400°C or above, and some types of polyimide can even be used for a long time at 450°C. This feature makes it particularly important in the aerospace and electronics industries.
Initial decomposition temperature: The initial decomposition temperature of PI materials is usually higher than 400°C. For example, the 5% and 10% decomposition temperatures of some polyimide films are 501-506°C and 510-514°C, respectively.
Glass transition temperature (Tg): The glass transition temperature of PI materials is also relatively high, usually exceeding 300°C, for example, some types of polyimide can reach 487°C. This high Tg value helps maintain the mechanical properties and dimensional stability of the material at high temperatures.
Wide range of applications: Due to its excellent heat resistance, polyimide is widely used in fields that require high temperature resistance, such as aerospace, microelectronics, liquid crystal display, etc.
These heat-resistant properties make PI Advanced Materials' polyimide materials an ideal choice in many high-tech applications.
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